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Organization / Research

Shimatsu Laboratory


[PHOTO.1] Takehito SHIMATSU, Professor

We have been expanding my study of two applications of sputter film deposition in a UHV atmosphere: fabrication of magnetic films having high uniaxial magnetic anisotropy Ku, and development of room-temperature bonding techniques for use in fabricating wafers.

The former study is aimed mainly at realizing high-capacity magnetic storage. Now co-workers and I focus on L10-type FePt granular films and Antiferromagnetically coupled Co based granular films.

Atomic diffusion bonding of two flat wafers at room temperature is the latter study. Any mirror-polished wafers can be bonded using thin metal films. High surface energies of metal films and a large atomic diffusion coefficient at the grain boundaries and film surfaces enable bonding at room temperature. We have been investigating the technical potential of bonding for application to device fabrication.

Group of Electrical Engineering, Communication Engineering,
Electronic Engineering, and Information Engineering, Tohoku University
6-6-05, Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi 980-8579, Japan
TEL : 022-795-7186 (Japanese Only)
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