Information
2017/02/20
3rd CIES Technology Forum (3/21-22, Tokyo)
Center for Innovative Integrated Electronic Systems (CIES) has conducted the CIES consortium through our cooperation with a diverse range of Japanese and foreign companies from fields such as materials, equipment, devices, circuits and systems, and has been developing various innovative technologies regarding integrated electronic systems. 3rd CIES Technology Forumwill be held to introduce the activities and accomplishments of CIES as follows:
3rd CIES Technology Forum
Bridge to the Sustainable Growth with Innovative Integrated Electronic Systems
From super low power edge computing and car electronics to AI systems
- Time & date, venue:
- March 21, 2017
| 10:30 - 17:30 | Day I International Symposium (Language: English) Station Conference Tokyo, Sapia Tower 5F, 501ABS |
| 18:00 - 19:30 | Banquet Station Conference Tokyo, Sapia Tower 4F, 402ABCD |
- March 22, 2017
| 10:00 - 17:40 | Day II Progress Report (Language: Japanese) Station Conference Tokyo, Sapia Tower 5F, 501ABS |
- Registration fee:
- Free (Banquet 7,000JPY)
- Program:
- http://www.cies.tohoku.ac.jp/3rd_forum/index.html
- Registration:
- http://www.cies.tohoku.ac.jp/3rd_forum/entry.html
- Advanced registration due date:
- March 17, 2017
Contact:
Center for Innovative Integrated Electronic Systems (CIES),
Tohoku University
468-1 Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi, 980-0845, Japan
Tel: +81-22-796-3410, Fax: +81-22-796-3432
E-mail: support-office(at)cies.tohoku.ac.jp
http://www.cies.tohoku.ac.jp/
