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2017/02/20

3rd CIES Technology Forum (3/21-22, Tokyo)

Center for Innovative Integrated Electronic Systems (CIES) has conducted the CIES consortium through our cooperation with a diverse range of Japanese and foreign companies from fields such as materials, equipment, devices, circuits and systems, and has been developing various innovative technologies regarding integrated electronic systems. 3rd CIES Technology Forumwill be held to introduce the activities and accomplishments of CIES as follows:

3rd CIES Technology Forum

Bridge to the Sustainable Growth with Innovative Integrated Electronic Systems
    From super low power edge computing and car electronics to AI systems

Time & date, venue:
  March 21, 2017
10:30 - 17:30 Day I International Symposium (Language: English)
Station Conference Tokyo, Sapia Tower 5F, 501ABS
18:00 - 19:30 Banquet
Station Conference Tokyo, Sapia Tower 4F, 402ABCD
  March 22, 2017
10:00 - 17:40 Day II Progress Report (Language: Japanese)
Station Conference Tokyo, Sapia Tower 5F, 501ABS
Registration fee:
  Free (Banquet 7,000JPY)
Program:
   http://www.cies.tohoku.ac.jp/3rd_forum/index.html
Registration:
   http://www.cies.tohoku.ac.jp/3rd_forum/entry.html
Advanced registration due date:
  March 17, 2017

Contact:
Center for Innovative Integrated Electronic Systems (CIES),
Tohoku University
468-1 Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi, 980-0845, Japan
Tel: +81-22-796-3410, Fax: +81-22-796-3432
E-mail: support-office(at)cies.tohoku.ac.jp
http://www.cies.tohoku.ac.jp/

Group of Electrical Engineering, Communication Engineering,
Electronic Engineering, and Information Engineering, Tohoku University
6-6-05, Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi 980-8579, Japan
TEL : 022-795-7186 (Japanese Only)
Email :

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