About us

Semiconductor devices have evolved beyond the traditional scaling approach guided by Moore’s law (the pursuit of miniaturization known as “More Moore”), to also emphasize multifunctionality and heterogeneous integration — a new development axis referred to as “More than Moore.” Future semiconductor systems will combine “More Moore” and “More than Moore” as two complementary driving forces, leading to high value-added systems that integrate diverse materials and functionalities. In this context, heterogeneous integration technology, which enables the integration of different materials and device functions, is now gaining significant attention as a key enabler for the sustainable growth of the semiconductor industry. Moreover, with the rapid advancement of artificial intelligence, leading-edge semiconductor devices used for AI applications increasingly rely on advanced packaging technologies to achieve higher performance and lower power consumption. Among these, chiplet technologies have drawn notable interest, and research on hybrid bonding is actively progressing. At Higurashi–Takeuchi Laboratory, research and development are being conducted on novel manufacturing technologies such as heterogeneous material integration and low-temperature bonding, contributing to the creation of innovative, compact, high-performance, and energy-efficient functional devices (including electronic, optical, sensor, actuator, and energy devices). These efforts aim to advance the sophistication of electronic system technologies that will underpin the future Internet of Things (IoT) society.